Laser processing

The customized positioning system enables high-precision laser cutting, laser drilling, laser trimming or laser engraving. The compact design with our OWIS products LINPOS S and ROTPOS M maps three degrees of freedom X-Y-θz.

Using our new direct-driven linear and rotative positioners and OWIS Engineering, we have realized a highly dynamic and at the same time highly precise positioning system.
This benefits the machining quality in the production of conductive tracks, electronic components, micro components and everywhere when high machining speeds with very high accuracies are required.

Key features

• High-precision positioning thanks to fine-resolution measuring systems
• High dynamics thanks to direct drive
• Uniform traverse speed for improved machining quality
• Compact design
• Integrated measuring system

Typical applications

• Laser processing: cutting, drilling, trimming, engraving

Competences

• Engineering, alignment and handling systems